product overview

Thick film printing technology is an advanced technique for manufacturing electronic components on 96% alumina ceramic substrates using thick film printing technology. This process is widely used in high reliability and high-performance electronic devices, such as automotive electronics, aerospace, medical equipment, and industrial control.

Research and development of thick film printed substrate products have high thermal conductivity, high mechanical strength, excellent reliability, processability, and high-precision dimensional controllability, making it easy to achieve high-density precision wiring.

The current application areas of the product include (but are not limited to):

Automotive electronics: engine control unit, sensors, ignition module, etc;

Aerospace: flight control systems, communication equipment, navigation systems, etc;

Medical equipment: medical imaging equipment, monitors, diagnostic equipment, etc;

Industrial control: PLC、 Inverter, power module, etc.

Yanchuang Dianke has the ability to produce 96% alumina ceramic substrates and develop corresponding thick film slurries. It can also provide substrates and matching electrode slurries required for thick film printing processes. We can also customize products of different sizes and thicknesses according to customer needs to meet different process and application requirements.

Product characteristics

High mechanical strength and high thermal conductivity;

Excellent sintering characteristics and process compatibility;

Excellent environmental reliability;

High precision size controllability, easy to achieve high-density wiring

Processing technology

Processing capability

96 ceramic substrate can meet the wiring conditions of a minimum line width of 200 μ m and a line spacing of 200 μ m, as well as the processing requirements of 200 μ m diameter through holes;

Acceptable customization, develop supporting materials and slurries according to customer product parameters and characteristics;

The recommended sintering curve is shown in the following figure.

Table of Electrical and Physical Performance Parameters of High Temperature Ceramic Materials

Aluminum oxide content (wt%) 96

Volume density (g/cm 3) ≥ 3.7

Bending strength MPa ≥ 300

Hardness (Gpa) ≥ 14

Thermal expansion coefficient (25-800 ℃) 10 ^ -6 7.7~8.0

Thermal conductivity (w/(m * k)) ≥ 21

Insulation strength (KV/mm) ≥ 15

Volume resistivity (25 ℃)/Q · cm)>10 ^ 14

Dielectric constant ε (1MHz) 9-10

Dielectric loss (1MHz)/10 ^ -4 ≤ 3

Roughness (Ra/um) 0.2~0.6

Dimensions (mm)

*The typesettable area should be less than 10mm in length and width of the board, 74 * 65 * 0.2

120*120*0.38/0.5   132*142*0.635   138*190*0.635/1.0

High temperature medium slurry and product performance parameter table

Dielectric sintering thickness (μ m) reference thickness 40-50

Dielectric constant (K) 8-10

Dielectric loss (%)<0.5

Insulation resistance>10 ^ 11

ohms at 100 VDC 

Breakdown voltage (VDC/25 μ m)>400 (25um)

Use slurry in conjunction with 96 porcelain

Number Name Application Slurry Model

1 thick film gold conductor paste gold conductor, gold wire bonding, bonding chip GY-HM01

2 thick film platinum silver conductor paste platinum silver conductor, welded PA-HM01

Internal silver conductor AY-HM01 in thick film silver conductor paste

4 thick film encapsulation paste white solder mask paste CLH-HM01

5 thick film silver through-hole paste filling AT-HM02

6 thick film transition through-hole paste filling PT-HM02

7 thick film dielectric paste printing dielectric paste MD-HM01