Electronic paste is the basic material for manufacturing thick film components, which is a paste made by uniformly mixing solid powder and organic solvent through three roll rolling. It is widely used in electronic device manufacturing by forming circuits or functional layers through processes such as screen printing and high-temperature sintering. As a new type of material, electronic paste is far superior to traditional circuit equipment (such as resistance wires, electric heating tubes, etc.), and has the characteristics of environmental protection, high efficiency, and energy saving. Its cost is also close to traditional materials, and it is currently the main application direction for miniaturization production of electronic components.

The thick film series of pastes developed by the company include Au paste, Ag paste, Pt paste, Pd paste, AgPd paste, PtPd paste, AgPt paste, AgPtPd. AuPtPd paste, W/Mo/Mn paste, Cu/Ni/C/BN paste and other conductors, as well as supporting hole filling paste, resistance paste (separately introduced), dielectric paste, insulation paste, encapsulation paste, etc. A sintered paste covering the temperature range of 400~1800 ℃, suitable for thick film hybrid integrated circuit wiring on substrates such as alumina, beryllium oxide, aluminum nitride, silicon nitride, zirconia, quartz, ferrite, microwave ceramics, glass glaze, etc.

The advantages of high-temperature thick film circuits are significant. In terms of material properties, it has the characteristics of high mechanical strength, high temperature resistance, stable chemical properties, good thermal stability, and excellent electrical insulation. In terms of circuit fabrication and performance, mature technology is conducive to mass production, flexible design can meet diverse needs, relatively low cost, reliable and stable performance, can withstand high power, and has good heat dissipation capability. In terms of size and integration, it can achieve miniaturization and integrate multiple components. Therefore, our company has specifically developed a complete set of thick film printing pastes to complement it, further improving its application system.

Product advantages:

1. Relatively low cost: The equipment and material costs are relatively affordable and suitable for large-scale production. The price of thick film printing equipment is relatively low, and the cost of materials such as conductive paste used is also reasonable.

2. Simple and easy to master process: The process is relatively mature, the production process is relatively simple, and the technical requirements for operators are not high. Reduced the cost of human training.

3. Can achieve diversified design: It has good adaptability to small batch and diversified production needs, and can quickly carry out product design and adjustment.

4. It can be printed on various ceramic substrates with a wide range of applications, such as alumina substrates, aluminum nitride substrates, etc.

5. Integration: Capacitors and resistors can be embedded in it, eliminating the cost of packaging components.